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High quality Fibreglass Through-plated PCB for high strength & reliabilty.
Standard 100x160mm Eurocard format.
Solder resist reduces risk of solder shorts.
1mm hole size allows fitting of 0.1" pin headers etc.
Rohs compliant Gold plated finish for good solderability and long shelf life
Overall perforated groundplane for good high-speed signal integrity
Underside track connectivity indicated by printed lines on top side silkscreen.
Silkscreen block areas for writing pin legends, serial numbers etc.
Hole grid allows snapping into multiple smaller sections
Through-hole area
Dense through-hole pattern with groups of 3 or 2 interconnected pads for high
density DIP layouts.
Uncommitted power/common clock rails can be linked as required.
SMD areas
Central 0.05" (1.27mm) area for SOICs, SOT-23 discretes etc, with 2 through-hole pads
per SMD pin for interconnection.
2 power (or clock) and 1 ground rail runs down each side of SMD area for quick & easy
hookup.
Fine-pitch SMD breakouts on underside for pitches of 0.5mm, 0.65mm. 0.8mm and 1.0mm for
ICs, FFC connectors, small discretes (e.g. SOT-323) etc
Dedicated connector areas - For easy fitting of a wide variety of standard connnector types :
Terminal blocks, large headers etc. with pitches of 0.15", 0.156", 5mm and
0.2"
2 rows x 22 way 2mm (e.g. for 2.5" hard drive connector)
1.27mm single-row and staggered rows for RJ11/RJ45 etc. (Room for two 8 way RJ45
connectors)
D connector 9/15/25 pins
2.5mm single-row
Plated-through slot holes for 2.1mm or 2.5mm DC power jack.
3x34 row 0.1" connector position with breakout pads, for DIN41612, 2-row IDC
connectors or 3 row 0.1" headers etc.
Component side view :
Underside :
Closeup of SMD areas
